Qualcomm X60 Modem Will Enable Faster, Slimmer 5G Phones
Updated: Added X60 sampling timeline.
Qualcomm today announced its third-generation 5G modem, the Snapdragon X60. The chip supports new types of 5G carrier aggregation compared to the X55 it replaces, including across TDD and FDD bands, and across mmWave and sub-6 bands. These new aggregation options will enable more carriers to offer faster 5G data speeds, including doubling potential sub-6 peak speeds. The chip also supports native voice calls over 5G (VoNR). Support for VoNR and the new aggregation options will help carriers transition from 5G NSA (non-stand-alone) to more advanced 5G SA (stand-alone) networks. The X60 is made using a cutting-edge 5nm manufacturing process, producing a smaller, more power-efficient modem chip. The X60 will sample to device makers this quarter. Alongside the X60, Qualcomm is also introducing a new mmWave antenna module (QTM535) that's narrower than the company's existing antenna modules, enabling slimmer phones that support mmWave 5G.
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