Sprint Pins Network Strategy On 'HPUE' Technology
Sprint today detailed a new technology called High Performance User Equipment that promises to improve the behavior of its 2.5 GHz spectrum in terms of capacity, speed, and range. HPUE is a modem-level technology that ushers in a new power class for mobile phones, called Power Class 2. In its simplest form, HPUE-capable phones can speak louder from the cell edge so the cell tower hears them. Despite the higher broadcasting output, Sprint says there are power efficiencies involved that allow HPUE to work without killing device batteries. It involves the modem, power amplifier, filter, software, and processor all working together to manage power output in the appropriate spectrum. The 3GPP approved the HPUE standard on Dec. 6. Sprint already has a wide range of partners helping it with the technology, including Qualcomm and MediaTek on the processor side, Broadcom and Skyworks on the amplifier side, and Samsung, ZTE, LG, HTC, Motorola, and Alcatel on the consumer device side. HPUE is independent from 3xCA (which Sprint is deploying now), but plays well with carrier aggregation and other technologies such as MIMO to improve capacity and speed. Combining HPUE, 3xCA, 256 QAM, and MIMO can deliver 1 Gbps speeds, according to Sprint, though that package won't be available for some time. HPUE relies on attributes of TDD-LTE and is specific to Band 41 spectrum. Other carriers with and 41, including China Mobile and Sprint parent SoftBank, are looking at the technology, too. Once deployed, Sprint expects a single HPUE-enabled 2.5 GHz cell tower will be able to cover approximately the same geographical area as a 1.9 GHz cell tower with similar speed characteristics. The actual improvement in geographical coverage is about 30% more than a 2.5 GHz cell tower could cover on its own without HPUE. Sprint will begin deploying HPUE cell sites and devices (including an unannounced Galaxy flagship handset from Samsung) in 2016, and expects 55% of its handsets to support HPUE by the end of 2017. In the meantime, Sprint will continue to expand the availability of 3xCA devices and markets.
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Dec 4, 2019
Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company's 6-series chips that have previously been common to higher-end (but not "flagship") phones in the US.
Nov 12, 2018
Intel today introduced the XMM 8160, a 5G modem that will bring high-speed connectivity to mobile phones, computers, and other broadband devices in 2020. The modem supports the 5G NR spec, including both standalone (SA) and non-standalone (NSA) modes for fixed and mobile service.
Jul 23, 2018
Qualcomm today announced new antennas that will bring mmWave and sub-6 GHz 5G to mobile devices such as smartphones. The QTM052 mmWave module and QPM5xx sub-6 GHz RF module are compact enough that they are suitable for phones.
Dec 5, 2018
Qualcomm today fully revealed the Snapdragon 855 mobile platform, its top-tier system-on-a-chip heading into 2019. Qualcomm focus on a number of pillars when developing this SoC, including performance, connectivity, AI, camera, and entertainment.