Motorola Shrinks Smartphone Chipset
Oct 23, 2003, 12:11 PM by (staff)
Motorola's Semiconductor Products Sector yesterday announced its new Mobile Extreme Convergence (MXC) architecture for mobile devices. The company claims that the new architecture permits the critical components of a high-performance mobile device to fit in an area the size of a postage stamp, compared to previous solutions the size of a business card. MXC is also designed to reduce the cost, complexity, and power consumption of mobile devices. The size reduction is due in part to the convergence of call processing and applications processing hardware. The first chips using the MXC architecture are expected to sample in the second half of 2004
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Dec 4, 2019
Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company's 6-series chips that have previously been common to higher-end (but not "flagship") phones in the US.
Dec 4, 2019
Qualcomm this week launched the "Snapdragon 865 and 765 Modular Platforms", which are pre-engineered and pre-certified circuit boards that include most of the critical components for a high-end 5G phone (or equivalent cellular device.) As phones have become more sophisticated and refined, the costs of developing a competitive high-end phone have become prohibitive for all but the largest companies. This new program from Qualcomm aims to level that playing field for smaller companies.
Oct 12, 2017
Samsung this week announced two new Isocell image sensors for smartphones and IoT devices. The first is the Isocell Fast 2L9 with Dual Pixel technology, a 12-megapixel sensor with pixels that measure 1.28-micrometers (Î¼m).
Jan 6, 2020
The Bluetooth SIG today announced Bluetooth LE Audio, a new part of the Bluetooth standard designed to replace all previous audio profiles, which will now be referred to as "Classic Audio". LE Audio uses the Bluetooth LE radio, a version of Bluetooth optimized for low power consumption.