Qualcomm's First Snapdragon with Integrated 5G is the 765
Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company's 6-series chips that have previously been common to higher-end (but not "flagship") phones in the US. In the Snapdragon lineup, the 765 sits just below the new flagship Snapdragon 865 chipset, also announced today. Unlike the 865, the 765 combines all of the processing cores together with the 5G modem on a single chip. This offers a smaller, more power-efficient, and more affordable solution compared to the 865, while still offering high-end performance. Qualcomm expects the 765 to help accelerate the adoption of 5G beyond expensive flagship devices. The Snapdragon 765 uses the latest 7nm manufacturing process — the same as the 865 — for better power efficiency. The 765's integrated X52 5G modem supports download speeds up to 3.7 Gbps, (compared to 7.5 Gbps for the X55 in the Snapdragon 865,) but otherwise supports everything the company's top-end 5G modems do, including both mmWave and sub-6 GHz frequency bands, SA and NSA modes, TDD and FDD, Dynamic Spectrum Sharing (DSS), global 5G roaming, and support for multi-SIM. The chip includes a new fast charging technology designed to extend the number of charges before a phone's battery loses significant capacity. The 765 will also be available in a 765G variant with 20% better graphics performance, for gaming phones. The first phones powered by the Snapdragon 765 are expected to ship in the first quarter of 2020. Read on for additional details.
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At the heart of the Snapdragon 765 is a Kryo 475 CPU with 8 cores (2 big + 6 little) running at up to 2.3 GHz.
The Adreno 620 GPU supports QHD+ displays at refresh rates up to 60 Hz, and FHD+ displays at rates up to 120 Hz. It also supports HDR10+, Dolby Vision, and can power 4K external displays at up to 60 Hz.
The Spectra 355 ISP (image signal processor) contains dual 14-bit cores with hardware-accelerated computer vision. This allows cameras up to 192 megapixels, as well as 4K HDR video capture with bokeh effect, slow-motion video capture at 480 fps (720p), and multi-frame noise reduction.
The on-chip Hexagon 696 is Qualcomm's 5th-generation AI processor, offering hardware acceleration for Tensor AI applications as well as voice assistants, and a special low-power mode for AI processing of multi-sensor data.
The 765 includes Quick Charge 4+ fast battery charging, as well as the new "Qualcomm Quick Charge AI", which preserves battery capacity over time, extending battery life cycles "up to 200 days".
Disclosure: Qualcomm covered all expenses for the author's trip to the Qualcomm Snapdragon Summit in Hawaii.
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Dec 3, 2019
Qualcomm today revealed that its next two chipsets for high-end 5G phones will be called the Snapdragon 865 and Snapdragon 765. The 765 — and a 765G variant for gaming phones — offers "integrated 5G connectivity, advanced AI processing, and select Snapdragon Elite Gaming experiences."
Feb 9, 2021
Qualcomm today introduced a suite of new modem and radio chips to power the next generation of higher-end 5G phones and devices. The company's new flagship 5G modem chip is the Snapdragon X65 5G Modem-RF System , which is the first in the world to support data rates of up to 10 Gbps.
Dec 2, 2020
Qualcomm today fully announced the Snapdragon 888 chip and provided details on its features and performance. As the company's new top-end chip for phones, the 888 is expected to power many flagship-tier Android phones in 2021, just as its predecessor the 865 powered most Android flagships in 2020.