MediaTek Unveils Range of Processors
MediaTek today announced several different processors that target a handful of industries. The MT2523 packages together an MCU, GPS, Bluetooth LE, and PMU into a single piece of silicon for wearables. An ARM Cortex M4 forms the low-power processor. MediaTek says the MT2523 is 41% smaller than competing modules and can power small, but high-resolution screens with a full range of color. The MT2523 is intended for devices running operating systems less robust than Google's Android Wear. The chip will become available during the first half of the year. MediaTek also announced the MT8581 processor for 4K Blu-ray players and the MT7697 for Internet of Things and home automation applications. MediaTek competes with Qualcomm and Samsung.
May 9, 2018
Google today provided more visibility into its work on Project Treble, which is meant to accelerate the rate at which phones are updated to new versions of Android. Google has been working with Qualcomm, MediaTek, and Samsung to improve how phones handle major updates.
May 31, 2018
ARM today announced a new series of processors cores for mobile devices that it says will increase performance without impacting battery life. The new Cortex A76 processor core is built using a 7nm process that ARM says delivers a 35% boost in speed and a 40% improvement in efficiency when compared to its previous 10nm core.
Oct 24, 2018
MediaTek today announced the Helio P70, a refreshed system-on-a-chip that goes head-to-head with Qualcomm's Snapdragon 600 and 700 series for sub-flagship devices. The Helio P70 is based on a 64-bit, octa-core CPU built from ARM Cortex A73 and A53 cores with clock speeds up to 2.1 GHz.
Sep 10, 2018
Qualcomm today announced the Snapdragon Wear 3100 platform, what the company calls a next-generation chip for wearables and other smart devices. To start, the 3100 is built on an ultra low-power hierarchy to conserve battery life.
May 26, 2020
Arm today announced a suite of new processing core intellectual property intended for the chips that will power high-end phones starting in 2021. The new designs are for the new, cutting-edge 5nm manufacturing process that is just becoming available for the most high-end chips.