Nokia, TI, ST Join Forces For CDMA Chipsets
May 15, 2003, 9:28 AM by (staff)
STMicroelectronics, Texas Instruments (TI), and Nokia today announced that TI and ST will offer complete CDMA chipsets based on technology developed jointly with Nokia. The chipsets will be marketed by ST and TI to handset manufacturers worldwide for cdma2000 1X and 1xEV-DV phones. Availability of qualified samples of the cdma2000 1X chipset is expected next quarter, and the trio also expects to deliver industry's first complete 1xEV-DV chipset. Most CDMA chipsets worldwide are currently designed and manufactured by Qualcomm.
Qualcomm Improves Its High-Tier Range with Snapdragon 660 and 630
May 8, 2017
Qualcomm today announced the Snapdragon 660 and Snapdragon 630 mobile platforms, two new systems-on-a-chip that the company says will dramatically improve speed, battery life, and photography for sub-flagship smartphones. The Snapdragon 660 succeeds the 653, while the 630 succeeds the 626.
Snapdragon 845 Boasts Advanced Imaging Tools and AI Smarts
Dec 6, 2017
Qualcomm today announced the Snapdragon 845 mobile platform, its flagship system-on-a-chip for 2018. Qualcomm expects the module to form the core of next year's top smartphones, which it will endow with multimedia smarts for both audio and video.
Qualcomm's Snapdragon 450 Platform Jumps to 14nm Process
Jun 27, 2017
Qualcomm today announced the Snapdragon 450 Platform, a new entry in its mid-tier range of processors for high-volume devices. The Snapdragon 450 is the first 400 series chip to make use of Qualcomm's 14nm process, which provides it with noticeable performance and efficiency gains over earlier chips.
Qualcomm Intros a Trio of Snapdragons and an LTE Modem
Feb 11, 2016
Qualcomm today announced a handful of processors alongside a new LTE modem for mobile devices. The Snapdragon 625, 435, and 425 all support LTE with carrier aggregation, 802.11ac with MU-MIMO, Quick Charge, and Qualcomm's TruSignal and Hexagon technology for better call and audio quality.