Broadcom Targets Ice Cream Sandwich with New Processors
Broadcom today announced three new platforms designed specifically for Android 4.0 Ice Cream Sandwich smartphones. All three processor platforms are based on ARM Cortex A9 CPUs and include VideoCore graphics, HD video capture, dual-band Wi-Fi, GPS+GLONASS, NFC, and Bluetooth 4.0. The BCM21654G has a 1GHz ARM Cortex A9, 7.2/5.8 Mbps HSPA modem and low-power VGA video support. The BCM28145 and BCM28155 include dual ARM Cortex A9 cores up to 1.3GHz, 21/5.8 Mbps HSPA+ modems and HD 720p and 1080p, video respectively. All three chips were developed with a 40 nanometer process and include radio frequency power management. The chips are expected to ship in products during the second half of the year.
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Mar 22, 2018
Samsung today announced the Exynos 7 Series 9610 mobile application processor, a chip built using Samsung's 10nm FinFET process that targets high-end smartphones. The octa-core processor has four Cortex A-73 cores at 2.3 GHz and four Cortex A-53 cores at 1.6 GHz.
May 31, 2018
ARM today announced a new series of processors cores for mobile devices that it says will increase performance without impacting battery life. The new Cortex A76 processor core is built using a 7nm process that ARM says delivers a 35% boost in speed and a 40% improvement in efficiency when compared to its previous 10nm core.
Jun 26, 2018
Qualcomm today announced three new Snapdragon processors, one in the 600 series and two in the 400 series. All three systems-on-a-chip make strides in efficiency, performance, and battery life, while also introducing advanced modem features and artificial intelligence.
Sep 10, 2018
Qualcomm today announced the Snapdragon Wear 3100 platform, what the company calls a next-generation chip for wearables and other smart devices. To start, the 3100 is built on an ultra low-power hierarchy to conserve battery life.