Samsung Says Bada-Tizen Tie-Up Still Being Weighed
Jan 17, 2012, 5:09 PM by Eric M. Zeman
Samsung has retreated from earlier statements it made regarding plans to merge its bada operating system with Intel's Tizen operating system. In a statement provided to AllThingsD, Samsung said, "Samsung and other members of Tizen Association have not made a firm decision regarding the merge of bada and Tizen. We are carefully looking at it as an option to make the platforms serve better for customers." Samsung said that it believes bada will play a role in "democratizing" smartphone platforms, and that it will continue to support open-source projects.
May 27, 2020
This summer, Samsung will launch Samsung Money by SoFi, a new financial product integrated with Samsung Pay. Like Apple Card, Samsung Money can be used as a payment method with the wallet app (Samsung Pay), the account is managed within the wallet app, and the product also includes a physical payment card.
Feb 11, 2020
A multi-state anti-trust lawsuit to stop the merger of Sprint and T-Mobile has failed. New York Attorney General Letitia James issued a statement saying "There is no doubt that reducing the mobile market from four to three will be bad for consumers, bad for workers, and bad for innovation, which is why the states stepped up and led this lawsuit.
Jul 1, 2020
T-Mobile US and Dish Network today announced that they have completed the previously-announced sale of Boost, the prepaid arm of Sprint. Dish now owns the Boost brand and takes responsibility for its 9.3 million customer accounts, hundreds of employees, and thousands of independent retailers.
Feb 5, 2021
A new company called Metalenz has developed a unique flat lens technology that is well on its way to revolutionizing the infrared 3D depth cameras used in many phones. The flat lens technology is much smaller than the traditional lens systems, and offers better performance.
Mar 4, 2022
A number of leading companies in the semiconductor industry have created a new standard for connecting multiple "chiplets" with different functions into one system-on-chip (SoC) package. This will enable a modular approach to designing the main chips that power phones and other devices.