Qualcomm's S4 SnapDragon Chips Boast Two Cores and LTE
Qualcomm has announced details of its next-generation SnapDragon processors, known in consumer parlance as the S4 line. The MSM 8960 S4 chip, for example, will include dual-core processors that are integrated with a Long Term Evolution 4G baseband chip. Combining the processor with the baseband will reduce the footprint needed for these components within smartphones and tablets. The result, says Qualcomm, will be much thinner devices that have better battery life and fast 4G wireless performance. The S4 line will also be able to support 3D capture as well as HD 3D video playback; augmented reality and gesture-based applications; and device-maker programmable digital signal processing to offer better quality audio. According to Qualcomm, the S4 chips are already sampling to select hardware makers and are expected to hit store shelves in some smartphones and tablets as soon as early 2012. Qualcomm said that the highest end of the S4 range of chips — the quad-core 8064 — is still under development and is expected to reach the market during the second half of 2012.
Qualcomm's Snapdragon 845 Relies On Semi-Custom Cores
Dec 6, 2017
Qualcomm today revealed that the Kryo 385 CPU in the Snapdragon 845 mobile platform does not use off-the-shelf cores and instead relies on semi-custom cores. Processor designers often use cores such as those created by ARM.
Qualcomm Improves Its High-Tier Range with Snapdragon 660 and 630
May 8, 2017
Qualcomm today announced the Snapdragon 660 and Snapdragon 630 mobile platforms, two new systems-on-a-chip that the company says will dramatically improve speed, battery life, and photography for sub-flagship smartphones. The Snapdragon 660 succeeds the 653, while the 630 succeeds the 626.
Snapdragon 855 Aims to Be the Best At Everything for 5G Phones
Dec 5, 2018
Qualcomm today fully revealed the Snapdragon 855 mobile platform, its top-tier system-on-a-chip heading into 2019. Qualcomm focus on a number of pillars when developing this SoC, including performance, connectivity, AI, camera, and entertainment.
Huawei Taps Leica to Help With P9 and P9 Plus
Apr 6, 2016
Huawei today unveiled two new smartphones at an event in London, the P9 and P9 Plus. Huawei developed the P9 and P9 Plus with help from Leica in order to improve camera performance.
Huawei Intros Kirin 980, a 7nm SoC for Next-Gen Smartphones
Aug 31, 2018
Huawei today announced the Kirin 980, its premiere system-on-a-chip for mobile devices. The chip adopts a 7nm process, allowing for a 20% boost in power output and a 40% jump in efficiency when compared to Huawei's 10nm process.