Samsung Fields 64GB NAND Embedded Memory Module
Samsung today announced a new memory chip for smartphones, tablets, and other mobile devices that offers 64GB of e-MMC NAND storage. Samsung used a 20nm process to create this chip, which allowed it to build an eight-die stack that is 1.4mm thick. Samsung says the module offers read speeds of up to 80Mbps, write speeds of 40Mbps, and a 60% increase in performance. Samsung said the memory module is meant to be used in high-end smartphones. Samsung didn't announce availability details.
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Jul 17, 2018
Samsung today announced what it says is the first 10nm 8 Gb LPDDR5 DRAM module for mobile devices. The new memory chip can push data at 6,400 Mbps, or 50% faster than current chips.
Dec 6, 2017
Qualcomm today announced the Snapdragon 845 mobile platform, its flagship system-on-a-chip for 2018. Qualcomm expects the module to form the core of next year's top smartphones, which it will endow with multimedia smarts for both audio and video.
Jul 23, 2018
Qualcomm today announced new antennas that will bring mmWave and sub-6 GHz 5G to mobile devices such as smartphones. The QTM052 mmWave module and QPM5xx sub-6 GHz RF module are compact enough that they are suitable for phones.
Jan 31, 2019
Samsung has a new storage chip for phones that can hold twice as much data in the same space as last year's chip, and enables faster data access. The new embedded Universal Flash Storage (eUFS) 2.1 chip can store 1 TB (1,000 GB) of data, in the same size as Samsung's 512 GB eUFS chip introduced in late 2017.