Motorola To Spin Off Chip Division
Oct 6, 2003, 9:19 AM by (staff)
Motorola today announced that it intends to separate its semiconductor operations into a publicly traded company. The company intends to increase its focus on communications and integrated electronic systems. The Semiconductor Products Sector (SPS) product portfolio includes chipsets and reference designs for mobile phones. Motorola is considering an initial public offering (IPO) of a portion of the new company. Motorola has not finalized details of the transaction.
Dec 3, 2019
Qualcomm today revealed that its next two chipsets for high-end 5G phones will be called the Snapdragon 865 and Snapdragon 765. The 765 — and a 765G variant for gaming phones — offers "integrated 5G connectivity, advanced AI processing, and select Snapdragon Elite Gaming experiences."
Dec 4, 2019
Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company's 6-series chips that have previously been common to higher-end (but not "flagship") phones in the US.
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Jan 31, 2019
Samsung has a new storage chip for phones that can hold twice as much data in the same space as last year's chip, and enables faster data access. The new embedded Universal Flash Storage (eUFS) 2.1 chip can store 1 TB (1,000 GB) of data, in the same size as Samsung's 512 GB eUFS chip introduced in late 2017.
May 31, 2018
ARM today announced a new series of processors cores for mobile devices that it says will increase performance without impacting battery life. The new Cortex A76 processor core is built using a 7nm process that ARM says delivers a 35% boost in speed and a 40% improvement in efficiency when compared to its previous 10nm core.