Qualcomm Announces New Platforms for 5G, Wi-Fi, and Bluetooth
Feb 28, 2022, 8:53 AM by Rich Brome @rbrome
Qualcomm today announced the X70 5G modem, S5 and S3 Sound Platforms for Bluetooth audio products, and FastConnect 7800 subsystem with Wi-Fi 7. The highlight of the X70 is a new set of AI processing technologies to improve modem performance. The X70 also include 4x downlink carrier aggregation, across TDD and FDD, sub-6 and mmWave. It also supports uplink carrier aggregation and switched uplink support across TDD and FDD. Qualcomm claims the X70 is the only solution capable of supporting every commercial 5G band in the world. It also supports standalone mmWave networks. The X70 has a upgradeable architecture "allowing rapid commercialization of 5G Release 16 features through software updates". The modem should make it into commercial devices by the end of the year, and it expected to be integrated into forthcoming Snapdragon SoC chips. Qualcomm's new chips for Bluetooth earbuds and similar products are the Qualcomm S5/S3 Sound Platform. These chips support new Bluetooth LE Audio features such as audio sharing, broadcasting, stereo recording, and gaming mode. They also support new high-quality modes for music and voice, more reliable wireless connections, and improved Adaptive Active Noise Cancellation. In addition to these features, the S5 adds a customizable DSP that allows manufacturers to add innovative, exclusive features. Commercial products using the S3/S5 are expected to ship in the second half of 2022. The FastConnect 7800 is Qualcomm's newest Wi-Fi/Bluetooth subsystem, which — like the X7 — will mainly reach consumers as an integrated part of forthcoming Snapdragon SoC chips. The key feature of the 7800 is support for Wi-Fi 7 and High Band Simultaneous (HBS) Multi-Link technology. This will allow ultra-fast connections using four simultaneous links in 5 GHz and/or 6 GHz bands. The 7800 also supports Bluetooth 5.3 and a feature called Intelligent Dual Bluetooth, which enables up to 2x range, as well as faster pairing and connection switching. Qualcomm says the first products using FastConnect 7800 will be available in the second half of 2022.
Feb 9, 2022
Samsung today announced its lineup of flagship phones for 2022: the Galaxy S22 series. The top-end S22 Ultra sees the biggest changes as it essentially absorbs Samsung's Note series with an integrated S Pen stylus and a more Note-like shape and design, instead of the Contour Cut design of the other models.
Sep 7, 2022
Apple has revealed the iPhone 14 series, with new features, improved specs, and new size options. In place of a Mini option, the iPhone 14 will come in the same 6.1-inch and 6.7-inch screen size options as the Pro models.
Nov 15, 2022
Qualcomm has announced its newest top-end chip, intended to power most flagship-level Android phones in 2023. As expected, the Snapdragon 8 Gen 2 is more powerful and power-efficient across the board (compared to Gen 1), but the most impressive improvements and new features involve AI.
Mar 23, 2021
OnePlus today announced the OnePlus 9 and OnePlus 9 Pro, its newest flagship phones. The 9 Pro is a true flagship-class phone with a QHD AMOLED display with variable refresh from 1 to 120 Hz, and IP68 water rating, starting at $969.
Jan 14, 2021
Samsung today officially unveiled its Galaxy S21 series of flagship phones for 2021. All three models sport a distinctive new "Contour Cut Camera" design where the metal frame extends around one corner to surround the rear cameras.