MediaTek Aims to Power Flagship Phones with Dimensity 9000
Chipmaker MediaTek has announced the Dimensity 9000, a high-powered, feature-rich SoC (system-on-chip) designed to be the heart of flagship-class phones. It's designed to compete with chips like Qualcomm's Snapdragon 888, and MediaTek claims it bests the 888 in a number of ways. It does not support mmWave 5G, which may limit its adoption in flagship phones with certain US carriers, most of all Verizon. The Dimensity 9000 is made using a cutting-edge 4nm manufacturing process for maximum efficiency. The CPU and GPU are based on Arm's new v9 architecture, with one Cortex X2 performance core, three Cortex A710 "big" cores, four Cortex A510 low-power cores, and Mali G710 MC10 for graphics. Other cores include a 6-core AI engine and an advanced triple ISP for imaging. The ISP can process input from three 32 megapixel cameras in real time, and supports triple-exposure HDR when capturing 4K video. The video engine can also encode 8K video and natively decode the new AV1 codec in 8K. The chip can drive full-HD displays at up to 180 Hz refresh, and higher-res displays at up to 144 Hz. The modem supports 5G release 16 features, including three-band carrier aggregation (CA) for download speeds up to 7 Gbps using only sub-6 bands (a world-first). The wireless features also include support for Bluetooth 5.3 (another world-first) with LE Audio, and Wi-Fi 6E. MediaTek's customers plan to ship phones using the Dimensity 9000 by the end of the first quarter 2022, starting in Asia and Europe.
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Dec 4, 2019
Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company's 6-series chips that have previously been common to higher-end (but not "flagship") phones in the US.
Qualcomm will make a big push to bring high-speed mmWave 5G to more affordable phones in 2022, according to comments made by CEO Cristiano Amon during a Q&A session at the company's Snapdragon Summit event in Hawaii today. For a phone to support mmWave 5G, multiple specialty antenna modules need to be added, which can raise a phone's price by $50 – 100.
Nov 26, 2019
MediaTek has revealed that its first SoC with integrated 5G modem and high-end processor will be called the Dimensity 1000. The company revealed the first set of details on the chip in May.
Feb 9, 2021
Qualcomm today introduced a suite of new modem and radio chips to power the next generation of higher-end 5G phones and devices. The company's new flagship 5G modem chip is the Snapdragon X65 5G Modem-RF System , which is the first in the world to support data rates of up to 10 Gbps.
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