Qualcomm Intros 10 Gigabit 5G Modem
Qualcomm today introduced a suite of new modem and radio chips to power the next generation of higher-end 5G phones and devices. The company's new flagship 5G modem chip is the Snapdragon X65 5G Modem-RF System, which is the first in the world to support data rates of up to 10 Gbps. The company also introduced the X62, a chip for slightly more mainstream phones that supports up to 4.4 Gbps. Both chips are made with a cutting-edge, power-efficient 4nm manufacturing process. They support all the features of the company's existing X60 modem, including 5G carrier aggregation (CA) with mmWave and sub-6 GHz bands. The X65 and X62 support the new 3GPP Release 16 standard, or "5G Phase 2", and have an "innovative" architecture that allows new features of the Rel. 16 standard to be added via software update. The company also introduced a full suite of companion RF chips and a new, fourth-generation mmWave antenna module. The new 545 mmWave antenna module supports higher transmit power for extended mmWave 5G coverage. The suite of chips includes a new feature called Qualcomm AI-Enhanced Signal Boost, which brings AI to antenna tuning for the first time. This uses AI to understand radio "context" (hand position, mostly) with 30% better accuracy, allowing better antenna tuning, which in turn means "faster data speeds, better coverage and longer battery life." The Snapdragon X65 and X62 are sampling to manufacturers now and "expected to be in commercially available 5G devices in late 2021."
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Dec 4, 2019
Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company's 6-series chips that have previously been common to higher-end (but not "flagship") phones in the US.
Dec 5, 2018
Qualcomm today fully revealed the Snapdragon 855 mobile platform, its top-tier system-on-a-chip heading into 2019. Qualcomm focus on a number of pillars when developing this SoC, including performance, connectivity, AI, camera, and entertainment.
Sep 10, 2018
Qualcomm today announced the Snapdragon Wear 3100 platform, what the company calls a next-generation chip for wearables and other smart devices. To start, the 3100 is built on an ultra low-power hierarchy to conserve battery life.