MediaTek's New Chip Aims to Make 5G Even More Affordable
MediaTek today announced the Dimensity 700, the company's most affordable 5G chipset to date. The chip should enable new 5G phones at prices well below $400. The 700 supports several advanced features, including support for 5G carrier aggregation (for faster 5G data) and a power-efficient 7nm manufacturing process. The 700 is an octa-core design with two Arm A76 primary cores running at up to 2.2 GHz. It supports full-HD displays with 90 Hz refresh and cameras up to 64 megapixel. It also supports multiple wake words for multiple voice assistants.
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Dec 4, 2019
Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company's 6-series chips that have previously been common to higher-end (but not "flagship") phones in the US.
Nov 30, 2021
Qualcomm has announced the Snapdragon 8 Gen 1, the company's flagship chipset to power 2022's top-end phones. The chip is the successor to the Snapdragon 888, but uses the new single-digit + generation naming scheme the company recently announced.
Nov 26, 2019
MediaTek has revealed that its first SoC with integrated 5G modem and high-end processor will be called the Dimensity 1000. The company revealed the first set of details on the chip in May.
Feb 18, 2020
Qualcomm today announced its third-generation 5G modem, the Snapdragon X60. The chip supports new types of 5G carrier aggregation compared to the X55 it replaces, including across TDD and FDD bands, and across mmWave and sub-6 bands.