MediaTek Intros Mid-Range 5G Chip
MediaTek today revealed its second SoC (System-on-Chip) for 5G phones: the Dimensity 820. The 820 is a more affordable relative of the Dimensity 1000, announced late last year. Dimensity chips integrate an application processor and 5G modem in one package, like Qualcomm's Snapdragon 765. The 820 supports advanced 5G technologies including carrier aggregation, DSS, VoNR, and SA. Like the Dimensity 1000, the 820 only supports sub-6 GHz 5G, not mmWave. The 820 also supports cameras up to 80 megapixels, 4K HDR video capture, and 120 MHz displays. It also has a dedicated AI processing cores. MediaTek says the Dimensity 820 is designed for 5G networks in "Asia, North America, and Europe", although it did not give a timeline for devices using the 820 to reach the market.
Dec 4, 2019
Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company's 6-series chips that have previously been common to higher-end (but not "flagship") phones in the US.
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Dec 3, 2019
Qualcomm today revealed that its next two chipsets for high-end 5G phones will be called the Snapdragon 865 and Snapdragon 765. The 765 — and a 765G variant for gaming phones — offers "integrated 5G connectivity, advanced AI processing, and select Snapdragon Elite Gaming experiences."
Nov 26, 2019
MediaTek has revealed that its first SoC with integrated 5G modem and high-end processor will be called the Dimensity 1000. The company revealed the first set of details on the chip in May.
Dec 5, 2018
Qualcomm today fully revealed the Snapdragon 855 mobile platform, its top-tier system-on-a-chip heading into 2019. Qualcomm focus on a number of pillars when developing this SoC, including performance, connectivity, AI, camera, and entertainment.
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