Tile Partners Up to put Their "finding power" in Bluetooth Devices
Tile — the company that makes tiny Bluetooth tags that help you find lost gear — has partnered up with a number of chip and audio-device companies to put its Tile technology into Bluetooth chipsets and reference designs. Ultimately, the company is trying to make it as easy as possible for Bluetooth device makers to include Tile technology in any (easily-lost) Bluetooth device. Tile has partnered with Qualcomm, Dialog Semiconductor, Silicon Labs, and Toshiba to work on their Bluetooth chipsets. Bose and Skullcandy already offer products with integrated Tile. The next wave of Tile-enabled Bluetooth devices will ship in the coming months from Sennheiser, Sol Republic, Plantronics and Soundcore by Anker.
May 9, 2018
Google today provided more visibility into its work on Project Treble, which is meant to accelerate the rate at which phones are updated to new versions of Android. Google has been working with Qualcomm, MediaTek, and Samsung to improve how phones handle major updates.
May 12, 2017
Google today announced Project Treble, which it hopes will solve the pain of updating smartphones to the latest version of Android. As it stands today, the process is multifaceted and includes a number of moving players, including Google, silicon makers, manufacturers, and carrier partners.
Jan 14, 2019
A new design for Bluetooth LE tags removes the need for a battery and fits into a cheap, thin, stamp-size sticker, or can be embedded directly in consumer product packaging. A tiny ARM processor transmits an ecrypted ID code like other Bluetooth tracking tags, but is powered by a new antenna design that harvests power from ambient radio waves.
Dec 5, 2018
Qualcomm today fully revealed the Snapdragon 855 mobile platform, its top-tier system-on-a-chip heading into 2019. Qualcomm focus on a number of pillars when developing this SoC, including performance, connectivity, AI, camera, and entertainment.
Dec 6, 2017
Qualcomm today announced the Snapdragon 845 mobile platform, its flagship system-on-a-chip for 2018. Qualcomm expects the module to form the core of next year's top smartphones, which it will endow with multimedia smarts for both audio and video.