Qualcomm Settles with Taiwan Over Patent Licensing Practices
Qualcomm has reached an agreement with Taiwan to close an investigation concerning its patent licensing practices. Qualcomm will pay a fine of $93 million, and has promised to invest some $700 million in Taiwan over the next five years. Taiwan had accused Qualcomm of improperly pressuring partners that wanted to use its chips with high royalty rates. Taiwan also accused Qualcomm of cutting Apple a discount on royalties to use its chips over that of competing firms. Qualcomm will have to license patents to its competitors, including Intel and MediaTek, at fair and reasonable rates before it takes them to court over fees. Qualcomm will have to provide a report to Taiwan's trade body every six months for the next five years to show that it is adhering to the terms. Qualcomm is facing similar disputes with the U.S. government, the European Commission, and the Korea Fair Trade Commission.
Google Pay Arrives to Fully Replace Android Pay and Google Wallet
Feb 20, 2018
Google today released Google Pay, the revised payment application and service that replaces Android Pay. Google Pay encompasses most features of Google Wallet and Android Pay in a single app, allowing people to use Google Pay to make payments online and via mobile devices.
Qualcomm Countersuit Says Apple Hobbled Its Chips
Apr 11, 2017
Qualcomm filed a retaliatory lawsuit against Apple and accused the iPhone maker of bad behavior. The filing is in response to one Apple made against Qualcomm earlier this year.
Qualcomm Settles with SEC Over China Incentives
Mar 1, 2016
Qualcomm today agreed to pay the SEC a fine of $7.5 million to settle an investigation being conducted over potential Foreign Corrupt Practices Act (FCPA) violations. The SEC alleges that Qualcomm improperly gave state representatives of China financial benefits including travel, jobs, gifts, and event tickets.
Snapdragon 700 from Qualcomm to Bring AI to Less Costly Phones
Feb 27, 2018
Qualcomm today announced the Snapdragon 700 Mobile Platform Series for sub-flagship handsets. This new processor tier is meant to outperform the 600 series while bringing the best tools of the 800 series down to a more affordable price point.