New Spec Means Flash Storage Is About to Get Faster
The Universal Flash Storage version 3.0, approved this week by JEDEC, will eventually lead to faster performance of flash memory chips. UFS 3.0 is optimized for smartphones, tablets, and automotive applications where power consumption needs to be minimized while delivering incredible throughput. JEDEC says UFS 3.0 takes advantage of M-PHY HS-Gear4, which doubles the data rate to 11.6 Gbps per lane when compared to M-PHY HS-Gear3. Tacking on support for the MIPI M-PHY v4.1 and MIPI UniPro v1.8 specifications means UFS 3.0 is able to more reliably form links and monitor for trouble. It carries over support for ultra lower power requirements and supports the latest NAND technology. JEDEC said it expanded the range of temperatures in which the the spec and associated gear can operate to better serve the automative market. Companies that make NAND flash components, such as Samsung, can put UFS 3.0 to work in their future flash storage designs. Operations that might be improved by UFS 3.0 include writing high-definition video to internal storage. It will take time for this technology to reach consumer devices.
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Dec 4, 2019
Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company's 6-series chips that have previously been common to higher-end (but not "flagship") phones in the US.
Jan 6, 2020
The Bluetooth SIG today announced Bluetooth LE Audio, a new part of the Bluetooth standard designed to replace all previous audio profiles, which will now be referred to as "Classic Audio". LE Audio uses the Bluetooth LE radio, a version of Bluetooth optimized for low power consumption.
Aug 31, 2018
Huawei today announced the Kirin 980, its premiere system-on-a-chip for mobile devices. The chip adopts a 7nm process, allowing for a 20% boost in power output and a 40% jump in efficiency when compared to Huawei's 10nm process.
Feb 9, 2021
Qualcomm today introduced a suite of new modem and radio chips to power the next generation of higher-end 5G phones and devices. The company's new flagship 5G modem chip is the Snapdragon X65 5G Modem-RF System , which is the first in the world to support data rates of up to 10 Gbps.