New Spec Means Flash Storage Is About to Get Faster
The Universal Flash Storage version 3.0, approved this week by JEDEC, will eventually lead to faster performance of flash memory chips. UFS 3.0 is optimized for smartphones, tablets, and automotive applications where power consumption needs to be minimized while delivering incredible throughput. JEDEC says UFS 3.0 takes advantage of M-PHY HS-Gear4, which doubles the data rate to 11.6 Gbps per lane when compared to M-PHY HS-Gear3. Tacking on support for the MIPI M-PHY v4.1 and MIPI UniPro v1.8 specifications means UFS 3.0 is able to more reliably form links and monitor for trouble. It carries over support for ultra lower power requirements and supports the latest NAND technology. JEDEC said it expanded the range of temperatures in which the the spec and associated gear can operate to better serve the automative market. Companies that make NAND flash components, such as Samsung, can put UFS 3.0 to work in their future flash storage designs. Operations that might be improved by UFS 3.0 include writing high-definition video to internal storage. It will take time for this technology to reach consumer devices.
Dec 6, 2017
Qualcomm today announced the Snapdragon 845 mobile platform, its flagship system-on-a-chip for 2018. Qualcomm expects the module to form the core of next year's top smartphones, which it will endow with multimedia smarts for both audio and video.
Aug 31, 2018
Huawei today announced the Kirin 980, its premiere system-on-a-chip for mobile devices. The chip adopts a 7nm process, allowing for a 20% boost in power output and a 40% jump in efficiency when compared to Huawei's 10nm process.
Jan 4, 2018
Samsung today announced the Exynos 9810, its flagship processor for the year, a chip that will likely form the heart of the company's Galaxy S series devices in a few months. The 9810 is built on Samsung's second-generation 10-nanometer FinFET process, which gives it a bump in speed and efficiency.
Jul 26, 2017
The USB 3.0 Promoter Group this week released the spec for USB 3.2, which has the potential to boost speeds through cables. Specifically, USB 3.2 takes advantage of the multi-lane operation that has been built into existing USB Type-C cables.
Jan 29, 2018
Nokia today announced new 5G chipsets that will triple the throughput of base stations while also drastically slashing power consumption. The ReefShark chipsets pair Nokia's antennas with artificial intelligence in order to push the performance of base stations.