Qualcomm's Quick Charge 4+ Promises Even Faster Power-Ups
Qualcomm today announced Quick Charge 4+, an update to the Quick Charge 4 spec that targets efficiency and heat management. Quick Charge 4+ has specific changes when compared to Quick Charge 4. First, Qualcomm updated the Dual Charge feature, which now includes two power management integrated circuits. This means devices charging via Dual Charge will see a divided charge current, lower thermal dissipation, and quicker charge times. Second, Quick Charge 4+ includes intelligent thermal balancing, which Qualcomm says automatically moves the current via the coolest path to eliminate hot spots. Lastly, Quick Charge 4+ can monitor both the phone casing and connector temperatures at the same time, which can further help prevent overheating and/or short-circuit failure in the Type-C connector. Since Quick Charge 4+ builds on the foundation set by Quick Charge 4, device makers will need to include all three of these new functions to gain the Quick Charge 4+ designation for marketing purposes. In the end, Qualcomm says Quick Charge 4+ delivers 3*C cooler charging temperatures, 15% quicker charging times, and an average of 30% more efficiency. It will be up to individual device makers to adopt Quick Charge 4+ in their hardware.
Dec 4, 2019
Qualcomm today announced the Snapdragon 865, its new top-end chipset to power flagship phones in 2020. Unlike most previous Snapdragon chips, the 865 is split into two physical chips: the main processor chip and a separate radio modem chip that includes a 5G modem based on the company's X55 5G modem.
Dec 4, 2019
Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company's 6-series chips that have previously been common to higher-end (but not "flagship") phones in the US.
Dec 5, 2018
Qualcomm today fully revealed the Snapdragon 855 mobile platform, its top-tier system-on-a-chip heading into 2019. Qualcomm focus on a number of pillars when developing this SoC, including performance, connectivity, AI, camera, and entertainment.
Aug 16, 2018
Google today said that it partnered with GN Hearing to create an open specification meant to stream audio to hearing aids. The published spec is called Audio Streaming for Hearing Aids (ASHA) on Bluetooth Low Energy Connection-Oriented Channels.
Aug 31, 2018
Huawei today announced the Kirin 980, its premiere system-on-a-chip for mobile devices. The chip adopts a 7nm process, allowing for a 20% boost in power output and a 40% jump in efficiency when compared to Huawei's 10nm process.