Qualcomm and TDK Partner Up On RF Joint Venture
Qualcomm and TDK today said they've agreed to form a joint venture that will see the companies create RF front-end modules for a wide range of devices. The two companies have created a venture called RF360 Holdings, which will be the legal parent of the new firm. Qualcomm said it will combine its expertise in wireless technologies with TDK's micro-acoustic filtering to devise fully-integrated RF systems for phones, IoT gear, and other connected tech. Modern smartphones need to support multiple cellular frequency bands in addition to Bluetooth, GPS, and WiFi. The ability to accurately filter out unneeded frequencies is paramount. The companies also agreed to collaborate on wireless charging and sensor technologies. Qualcomm and TDK believe this joint venture will be able to address the changing needs of the mobile industry.
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Samsung's Gear S2 Runs Tizen and Can Make Calls
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New Qualcomm Tech Aims to Bring High-Quality AR and VR Mainstream
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