New 3G Chip From Qualcomm Brings UMTS / HSDPA To Masses
Nov 14, 2006, 2:43 PM by (staff)
Qualcomm has introduced a new single chip solution for phones that combines quad-band GSM / EDGE with tri-band UMTS or HSDPA. The 3G frequencies can be tuned to be Euro-centric (900/1800/2100), America centric (850/1700/1900) or any combination of 1 low frequency and 2 high frequency bands. The chip can also provide a variety of multimedia features like support for 3 Megapixel cameras, 15 fps video recording, advanced audio and video playback and USB 2.0 High Speed. Not only can this one chip provide the functionality included in mid-range 3G handsets, it is only 1/2 inch square. This should help manufacturers to reduce the size and increase battery life of future 3G phones. However samples of the chip will not be available until late next year, and phones using it will probably not hit shelves until 2008.
Asus ZenFone AR Combines Tango, Daydream, 8 GB RAM
Asus today announced the ZenFone AR, the first phone to support both Project Tango AR and Daydream VR from Google. This large phone sports a 5.7-inch WQHD AMOLED display, Qualcomm Snapdragon 821 processor, an unprecedented 8 GB of RAM, and an advanced vapor cooling system.
Qualcomm Intros 802.11ad 60 GHz WiFi for Phones
Qualcomm and Letv today announced the first phone with the Snapdragon 820 and Wi-Fi 802.11ad, which operates in the very high-frequency 60 GHz radio band. The Letv Le Max Pro also includes Qualcomm's Sense ID ultrasonic fingerprint sensor.
Qualcomm's Snapdragon 450 Platform Jumps to 14nm Process
Qualcomm today announced the Snapdragon 450 Platform, a new entry in its mid-tier range of processors for high-volume devices. The Snapdragon 450 is the first 400 series chip to make use of Qualcomm's 14nm process, which provides it with noticeable performance and efficiency gains over earlier chips.
Samsung Touts Exynos ModAP Chip
Samsung today announced the Exynos ModAP, an application processor and modem system-on-a-chip. Samsung says the Exynos ModAP was manufactured using a 28nm processes and supports a wide range of wireless networking technologies.
LeTV Max Pro Calls Dibs On Qualcomm Snapdragon 820 Chip
LeTV today announced the Max Pro, the first smartphone to use the Qualcomm Snapdragon 820 processor. In addition to Qualcomm's flagship chip, the Max Pro takes advantage of 802.11ad 60 GHz WiFi from Qualcomm and Qualcomm's ultrasonic fingerprint technology.
I guess I see why Moto signed up with them for UMTS
These advances take ToOoOoOooo Looong! ! ! ! ! ! !
T-Mobile USA is going to jump all over this.
Now, lets see those handsets.
I want one...