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Qualcomm Promises to Fix Global LTE Mess with RF Solution

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Replying to:  Sounds like by Memo   Feb 21, 2013, 11:03 AM

a lot of stuff

by Rich Brome (Moderator)    Feb 21, 2013, 11:24 AM

Yes, but these are all things that need to go into new phones anyway. Part of Qualcomm's achievement here is using 3D packaging techniques to stack several (previously separate) radio parts onto one "chip".

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