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Qualcomm Promises to Fix Global LTE Mess with RF Solution

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This forum is closed.

This forum is closed.


Feb 21, 2013, 11:03 AM

Sounds like

A lof of pieces to put together under 1 phone.
Yes, but these are all things that need to go into new phones anyway. Part of Qualcomm's achievement here is using 3D packaging techniques to stack several (previously separate) radio parts onto one "chip".
Sounds like a big step in the right direction to me. Been hearing lots of good stuff from Qualcomm lately.
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