Texas Instruments Intros Low-Power Bluetooth Chip
Texas Instruments today announced the CC2541, a new low energy Bluetooth system-on-chip (SoC) that targets sensors and other data-collecting accessories. The chip uses the Bluetooth 4.0 spec, and the CC2541 promises to deliver 33% savings in power consumption. The chip will let companies design low-power sensor devices that can operate for more than a year on a coin cell battery. Bluetooth 4.0 has recently begun appearing on more smartphones, which will be compatible with sensor devices that use this SoC from Texas Instruments.
Qualcomm's Latest Bluetooth Module Targets Voice Assistants
Qualcomm today announced the Low Power Bluetooth SoC QCC5100 Series module for wearables and hearables. The SoC is meant to empower small form factor hardware by reducing power requirements and adding advanced features at the same time.
Huawei Takes Aim at Snapdragon 810 with Kirin 950
Huawei today announced the Kirin 950 chipset for phones, which is designed to compete with Qualcomm Snapdragon 800-series chipsets in higher-end phones. Huawei claims that the 950 is 25% faster and 44% more power-efficient than the Snapdragon 810, Qualcomm's current flagship chip.
Snapdragon Wear to Serve as Qualcomm's Smartwatch Platform
Qualcomm today announced Snapdragon Wear, a new platform for wearable devices. The Snapdragon Wear 2100 system-on-a-chip is the first product in the Snapdragon Wear platform and is meant to improve next-generation smartwatches.
Qualcomm's Snapdragon 835 Targets Flagships
Qualcomm today announced the Snapdragon 835, its premiere processor for 2017. Qualcomm says the chip is smaller, faster, and more efficient than any previous processor from the company.
Helio X30 Is MediaTek's Premium Mobile Processor
MediaTek today announced the Helio X30 system-on-chip, its most advanced mobile processor for smartphones. The chip relies on a 10nm process, which gives it 2.4 times more processing power and 60% more efficiency when compared to MediaTek's 16nm process.