DoCoMo Corrals Chip Companies To Take On Qualcomm
NTT DoCoMo today announced a joint venture with Fujitsu, NEC, Panasonic, and Samsung to "develop and sell semiconductor products for mobile devices." The chips will focus on LTE and LTE-Advanced technology. The venture should allow the companies to reduce their dependence on Qualcomm. The companies are still working out details, and expect the venture to commence operations at the end of March 2012. To get the ball rolling early, DoCoMo plans to establish a subsidiary called Communication Platform Planning Co. by mid-January, which will then become part of the joint venture.
LG X Venture Delivers Inexpensive, Rugged Performance
LG today announced the X venture, an affordable Android smartphone that can take a beating. The phone has an IP68 rating for protection against water and dust, and a mil-spec 810g rating for durability against drops, bumps, scrapes, and other abuse.
Qualcomm Partners Up with Chinese Makers for 14nm Chips
Qualcomm plans to form a joint venture with Semiconductor Manufacturing International in China to develop 14nm chips. China's Huawei and Belgium's Imec will also participate in the venture.
Qualcomm and TDK Partner Up On RF Joint Venture
Qualcomm and TDK today said they've agreed to form a joint venture that will see the companies create RF front-end modules for a wide range of devices. The two companies have created a venture called RF360 Holdings, which will be the legal parent of the new firm.
Sprint Expands Retail Deal with Dixons Carphone to 500 Stores
Sprint today announced a joint venture between it and Dixons Carphone to open 500 Sprint stores around the U.S. The joint venture follows a pilot program the two companies launched last year that saw them test Dixons' best practices in some 20 Sprint stores.