Broadcom Announces HSPA+ 1.1GHz Dual-Core Chip
Broadcom today announced a new baseband processor for smartphones that combines dual ARM Cortex A9 cores at 1.1GHz with a VideoCore IV with vector processing unit (VPU) to handle media tasks. The baseband is paired with an HSPA+ modem capable of downloads at 21Mbps. It supports HD video playback and capture, 3D video and image capture, camera sensors up to 20 megapixels, and support for advanced camera features such as red eye reduction and smile detection.
MediaTek Packs 10 Cores in TriCluster Helio X20 Chip
MediaTek today announced the Helio X20, a mobile application processor that packages 10 cores together in three separate clusters. Many of today's high-end processors package eight cores in two clusters.
Samsung's Exynos 9 Chip Uses 10nm Process, Boasts Gigabit Modem
Samsung today announced the Exynos 9 Series 8895 application processor for premium mobile devices. The chip relies on Samsung's 10nm FinFET process with 3D transistors.
Samsung Reveals Exynos 7870 for Mid-Range Phones
Samsung today announced the Exynos 7 Octa 7870, a new mobile processor that targets mid-level handsets. The 7870 is manufactured using Samsung's 14nm FinFET process and consumes 30% less power than the previous generation 7xxx chip.
Broadcom Looking to Get Out Of the Baseband Business
Broadcom today indicated that it is looking to exit the cellular baseband radio-making business. The company is exploring strategic alternatives, including a potential sale or wind-down of its baseband business unit.
Helio X30 Is MediaTek's Premium Mobile Processor
MediaTek today announced the Helio X30 system-on-chip, its most advanced mobile processor for smartphones. The chip relies on a 10nm process, which gives it 2.4 times more processing power and 60% more efficiency when compared to MediaTek's 16nm process.