Qualcomm Intros HSPA+ and Budget Chips
Qualcomm recently announced a series of new chipsets for mobile phones and other devices. Most notably, it has a new line of HSPA+ chips for next-generation wireless networks and high-end phones. These chips include Bluetooth, GPS and FM radios, and have the ability to support speeds of up to 42Mbps on 3G networks worldwide. In addition to the radios, these new chips can also support 3D/2D graphics; 16 megapixel cameras; full 1080p HD video playback and recording; DTS/Dolby 5.1 surround sound; assisted-GPS, and 24-bit WXGA (1280 x 800) displays. Qualcomm also introduced a line of chips for less expensive phones. These chips support HSDPA/HSUPA 3G networks via the Android, Symbian S60, Windows Mobile and BREW Mobile platforms. On those platforms the chips can power 8 megapixel cameras, Bluetooth 2.1, GPS, and 30 fps WVGA video. The chips will sample later this year.
Qualcomm Reaches Deal To Acquire NXP
Qualcomm today announced a deal to acquire NXP Semiconductors for $47 billion. NXP is a co-inventor and key patent holder of NFC technology.
Qualcomm Raises Its Bid for NXP
Qualcomm today increased its offer to acquire NXP Semiconductors to $127.50 per share, or about $44 billion. The new offer reflects the increased value of each company, both of which have grown since the deal originated.
Apple Files Yet Another Lawsuit Against Qualcomm
Apple is taking Qualcomm to court in the U.K. over patent-licensing fees.
Qualcomm's Snapdragon 450 Platform Jumps to 14nm Process
Qualcomm today announced the Snapdragon 450 Platform, a new entry in its mid-tier range of processors for high-volume devices. The Snapdragon 450 is the first 400 series chip to make use of Qualcomm's 14nm process, which provides it with noticeable performance and efficiency gains over earlier chips.
Qualcomm To Build Wireless Charging Into Snapdragon Chips
Qualcomm revealed this week that it will start building AirFuel wireless charging technology into its Snapdragon series of SoCs (system-on-chips). The support will include all of the logic and primary circuitry to support both inductive and resonant wireless charging technologies.