12 Megapixel Camera Chip Intro'd By NEC
Today NEC announced a new chip that will be capable of powering 12 megapixel cameras and the ability to record in 1080p HD resolution in phones. The new chip, called CE143, will also support image stabilization and NEC says that it can process handles face recognition software 25 times faster than solutions based on software. NEC will sample the chip in March and should reach full production by April.
Huawei Announces Kirin 970 With AI Co-Processor
Today at IFA in Berlin, Huawei announced its next flagship mobile SoC, the Kirin 970. Huawei claims the chip is the first to have a dedicated co-processor for AI, which it calls an NPU (Neural-network Processing Unit).
Xiaomi Announces the Surge S1, Its First Mobile Processor
Xiaomi today showed off the Surge S1, a mobile processor that it developed in-house. Only a handful of companies make their own processors, including Apple, Huawei, and Samsung.
LeTV Max Pro Calls Dibs On Qualcomm Snapdragon 820 Chip
LeTV today announced the Max Pro, the first smartphone to use the Qualcomm Snapdragon 820 processor. In addition to Qualcomm's flagship chip, the Max Pro takes advantage of 802.11ad 60 GHz WiFi from Qualcomm and Qualcomm's ultrasonic fingerprint technology.
Samsung's Exynos 9 Chip Uses 10nm Process, Boasts Gigabit Modem
Samsung today announced the Exynos 9 Series 8895 application processor for premium mobile devices. The chip relies on Samsung's 10nm FinFET process with 3D transistors.
Huawei Takes Aim at Snapdragon 810 with Kirin 950
Huawei today announced the Kirin 950 chipset for phones, which is designed to compete with Qualcomm Snapdragon 800-series chipsets in higher-end phones. Huawei claims that the 950 is 25% faster and 44% more power-efficient than the Snapdragon 810, Qualcomm's current flagship chip.