Wafer-Thin Digital Camera Technology Developed
Jun 11, 2007, 4:23 PM by (staff)
Tessera Technologies has created OptiML WLC, a new process that helps to shrink digital camera components for use in devices such as cell phones. The new technology reduces the size by 50% and costs by 30%, making the camera modules smaller and cheaper for integration into other electronics. It works by manufacturing thousands of lenses simultaneously on a wafer and bonding them together to create the optical element. The optics will still allow for auto-focus and digital optical zoom, all without moving parts.
Asus Zenfone Zoom Has 3x Optical Zoom
Asus today announced the Zenfone Zoom, an Android phone with top-end camera features. The 13-megapixel camera has a 10-element lens with 3x optical zoom, laser focusing, optical image stabilization, and a macro mode.
Asus Says Zenfone Zoom to Reach US In February
Asus today announced plans to bring the Zenfone Zoom to the U.S. The Zoom was first announced a full year ago at CES 2015.
Apple Showcases iPhone 7 with New Home Button
Apple today announced the iPhone 7, the latest version of its flagship product. The device is machines from aluminum and features a refreshed design.
Oppo's 5x Dual Camera Zoom Makes Use of a Periscope
Oppo today announced a new camera module that hides a telephoto lens inside the phone chassis. The main camera makes use of a wide-angle lens.
auto focus with no moving parts??