Wafer-Thin Digital Camera Technology Developed
Jun 11, 2007, 4:23 PM by (staff)
Tessera Technologies has created OptiML WLC, a new process that helps to shrink digital camera components for use in devices such as cell phones. The new technology reduces the size by 50% and costs by 30%, making the camera modules smaller and cheaper for integration into other electronics. It works by manufacturing thousands of lenses simultaneously on a wafer and bonding them together to create the optical element. The optics will still allow for auto-focus and digital optical zoom, all without moving parts.
|auto focus with no moving parts??||pennyless10||
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