Freescale Slims Down 3G Phones
Jul 26, 2006, 2:23 PM by (staff)
Freescale has announced a new manufacturing technique that could reduce the bulk of 3G phones. The new manufacturing process reduces the bulk of a 3G chipset by up to 30%. Freescale's new package includes all the processors and components necessary to run a 3G phone in a 1 inch square package. Unlike many methods which typically use more expensive or less reliable processes to shrink cell phone chipsets, the technology Freescale uses claims to be less expensive and more advanced. Thus the company claims it will not only shrink the size of 3G phones, but also the cost. Freescale often announces chipsets up to a year before they are ready, and does not expect phones with these chipsets to be available until 2008.
Innovative Keyboard Case is Both Wireless and Battery-Free
One2Touch has a new keyboard case for Android phones called SlimType that uses NFC technology in a unique way to connect to a phone. Most keyboard cases have a battery or physical connector that adds bulk.
Huawei Takes Aim at Snapdragon 810 with Kirin 950
Huawei today announced the Kirin 950 chipset for phones, which is designed to compete with Qualcomm Snapdragon 800-series chipsets in higher-end phones. Huawei claims that the 950 is 25% faster and 44% more power-efficient than the Snapdragon 810, Qualcomm's current flagship chip.
Qualcomm Reaches Deal To Acquire NXP
Qualcomm today announced a deal to acquire NXP Semiconductors for $47 billion. NXP is a co-inventor and key patent holder of NFC technology.
ZTE Reveals the Axon Flagship Phone for the US In Full
ZTE today announced the Axon phone, the first in what will be a line of flagship smartphones. ZTE will use the Axon brand in a way similar to how Samsung uses the Galaxy brand for its best phones.
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