Freescale Slims Down 3G Phones
Jul 26, 2006, 2:23 PM by (staff)
Freescale has announced a new manufacturing technique that could reduce the bulk of 3G phones. The new manufacturing process reduces the bulk of a 3G chipset by up to 30%. Freescale's new package includes all the processors and components necessary to run a 3G phone in a 1 inch square package. Unlike many methods which typically use more expensive or less reliable processes to shrink cell phone chipsets, the technology Freescale uses claims to be less expensive and more advanced. Thus the company claims it will not only shrink the size of 3G phones, but also the cost. Freescale often announces chipsets up to a year before they are ready, and does not expect phones with these chipsets to be available until 2008.
Innovative Keyboard Case is Both Wireless and Battery-Free
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Huawei Takes Aim at Snapdragon 810 with Kirin 950
Huawei today announced the Kirin 950 chipset for phones, which is designed to compete with Qualcomm Snapdragon 800-series chipsets in higher-end phones. Huawei claims that the 950 is 25% faster and 44% more power-efficient than the Snapdragon 810, Qualcomm's current flagship chip.
More Phones Should Be Able to Update to Android P Faster
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Qualcomm Reaches Deal To Acquire NXP
Qualcomm today announced a deal to acquire NXP Semiconductors for $47 billion. NXP is a co-inventor and key patent holder of NFC technology.
Nokia's ReefShark Chips to Connect 5G Base Stations
Nokia today announced new 5G chipsets that will triple the throughput of base stations while also drastically slashing power consumption. The ReefShark chipsets pair Nokia's antennas with artificial intelligence in order to push the performance of base stations.
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