Huawei Takes Aim at Snapdragon 810 with Kirin 950
Huawei today announced the Kirin 950 chipset for phones, which is designed to compete with Qualcomm Snapdragon 800-series chipsets in higher-end phones. Huawei claims that the 950 is 25% faster and 44% more power-efficient than the Snapdragon 810, Qualcomm's current flagship chip. The chip is made by TSMC using their cutting-edge 16nm FinFET+ process, a first in a phone SoC. This is superior to the 20nm process used by Qualcomm's 810 - particularly in power efficiency - although the imminent 820 will use a 14nm process. The Kirin 950 has eight cores in a big/little configuration, with four ARM Cortex A72 cores running at 2.3 GHz, and four A53 cores running at 1.8 GHz. The chip is designed specifically to optimize Android performance, and includes much-improved optimizations for camera performance and quality. The Kirin 950 includes an LTE Category 6 modem, support for VoLTE, and Huawei's new, more-efficient i5 dedicated sensor hub processor. Previous Kirin chips have been used in many Huawei phones sold around the world, including the recent P8 and Mate S.
Hands On with the Huawei Mate 10 and Mate 10 Pro
Huawei is taking aim at Apple, Samsung, and LG with its latest flagship handsets, the Mate 10 and Mate 10 Pro. These high-quality devices feature stunning hardware, top specs, and table-stakes features such as fingerprint readers.
Huawei's Mate 8 Uses Custom Kirin Processor
Huawei today announced the Mate 8, a flagship phablet that runs Android 6.0 Marshmallow. The Mate 8 features a 6-inch full HD display and Huawei's new processor, the Kirin 950.
Huawei Announces Kirin 970 With AI Co-Processor
Today at IFA in Berlin, Huawei announced its next flagship mobile SoC, the Kirin 970. Huawei claims the chip is the first to have a dedicated co-processor for AI, which it calls an NPU (Neural-network Processing Unit).
MediaTek Packs 10 Cores in TriCluster Helio X20 Chip
MediaTek today announced the Helio X20, a mobile application processor that packages 10 cores together in three separate clusters. Many of today's high-end processors package eight cores in two clusters.