Samsung Touts Exynos ModAP Chip
Samsung today announced the Exynos ModAP, an application processor and modem system-on-a-chip. Samsung says the Exynos ModAP was manufactured using a 28nm processes and supports a wide range of wireless networking technologies. The combo chip has a dedicated image signal processor to handle high-quality image and video capture/playback, all while conserving power. In addition to the SoC, Samsung introduced a 300 Series modem, which supports legacy 2G and 3G networks, such as GSM, HSPA+, and TD-SCDMA, in addition to LTE, and LTE-Advanced with features such as Carrier Aggregation. Last, Samsung revealed the Exynos RF companion chip. The Exynos RF IC is a baseband RF transceiver that supports multi-band and multimode LTE networks. Samsung didn't say when it expects these chips to reach consumer devices. The ModAP, in particular, will compete more directly with Qualcomm's high-end Snapdragon processors, which often integrate the AP and modem into a single chip.