NTT DoCoMo Dissolves Processor Plan
NTT DoCoMo today cancelled plans to form a joint venture with Fujitsu, Fujitsu Semiconductor, NEC, Panasonic Mobile Communications, and Samsung Electronics that would have had the companies working together to create mobile processors. The joint venture was first announced in December with the goal of competing with chips from Qualcomm and Broadcom. The joint venture was dissolved because a consensus on the details of the company could not be reached by the target deadline, which was the end of March.
Qualcomm and TDK Partner Up On RF Joint Venture
Qualcomm and TDK today said they've agreed to form a joint venture that will see the companies create RF front-end modules for a wide range of devices. The two companies have created a venture called RF360 Holdings, which will be the legal parent of the new firm.
Qualcomm Partners Up with Chinese Makers for 14nm Chips
Qualcomm plans to form a joint venture with Semiconductor Manufacturing International in China to develop 14nm chips. China's Huawei and Belgium's Imec will also participate in the venture.
Sprint Expands Retail Deal with Dixons Carphone to 500 Stores
Sprint today announced a joint venture between it and Dixons Carphone to open 500 Sprint stores around the U.S. The joint venture follows a pilot program the two companies launched last year that saw them test Dixons' best practices in some 20 Sprint stores.
LG X Venture Delivers Inexpensive, Rugged Performance
LG today announced the X venture, an affordable Android smartphone that can take a beating. The phone has an IP68 rating for protection against water and dust, and a mil-spec 810g rating for durability against drops, bumps, scrapes, and other abuse.